1. general description the 74ahc240-q100 and 74ahct240-q100 are 8-bit inverting buffer/line drivers with 3-state outputs. these devices can be used as two 4-bit buffers or one 8-bit buffer. they feature two output enables (1oe and 2oe ), each controlling four of the 3-state outputs. a high on noe causes the outputs to assume a high-impedance off-state. inputs are over voltage tolerant. this feature allows the use of these devices as translators in mixed voltage environments. this product has been qualified to the automotive electronics council (aec) standard q100 (grade 1) and is suitable for use in automotive applications. 2. features and benefits ? automotive product qualif ication in accordance with aec-q100 (grade 1) ? specified from ? 40 ? c to +85 ? c and from ? 40 ? c to +125 ? c ? balanced propagation delays ? all inputs have a schmitt-trigger action ? inputs accept voltages higher than v cc ? for 74ahc240-q100 only: operates with cmos input levels ? for 74ahct240-q100 only: operates with ttl input levels ? esd protection: ? mil-std-883, method 3015 exceeds 2000 v ? hbm jesd22-a114f exceeds 2000 v ? multiple package options 74ahc240-q100; 74ahct240-q100 octal buffer/line driver; inverting; 3-state rev. 1 ? 6 november 2013 product data sheet
74ahc_ahct240_q100 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserve d. product data sheet rev. 1 ? 6 november 2013 2 of 17 nxp semiconductors 74ahc240-q100; 74ahct240-q100 octal buffer/line driver ; inverting; 3-state 3. ordering information 4. functional diagram table 1. ordering information type number package temperature range name description version 74AHC240D-Q100 ? 40 ? c to +125 ? c so20 plastic small outline package; 20 leads; body width 7.5 mm sot163-1 74ahct240d-q100 74ahc240pw-q100 ? 40 ? c to +125 ? c tssop20 plastic thin shrink small outline package; 20 leads; body width 4.4 mm sot360-1 74ahct240pw-q100 74ahc240bq-q100 ? 40 ? c to +125 ? c dhvqfn20 plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; 20 terminals; body 2.5 ? 4.5 ? 0.85 mm sot764-1 74ahct240bq-q100 fig 1. logic symbol fig 2. iec logic symbol mgu779 1a3 1a2 1a1 1a0 2 4 6 8 1 1y0 1y1 18 16 14 12 1y2 1y3 1oe 2a3 2a2 2a1 2a0 17 15 13 11 19 2y0 2y1 3 5 7 9 2y2 2y3 2oe 12 14 2 4 6 8 18 16 1 en mgu778 3 5 11 13 15 17 9 7 19 en
74ahc_ahct240_q100 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserve d. product data sheet rev. 1 ? 6 november 2013 3 of 17 nxp semiconductors 74ahc240-q100; 74ahct240-q100 octal buffer/line driver ; inverting; 3-state 5. pinning information 5.1 pinning 5.2 pin description (1) this is not a supply pin. the substrate is attached to this pad using conductive die atta ch material. there is no electrical or mechanical requi rement to solder this pad. however, if it is soldered, the solder land should remain floating or be connected to gnd. fig 3. pin configuration so20 and tssop20 fig 4. pin configuration dhvqfn20 $ + & |